★COMPUTER CONNECT - IR6500 Rework station can be connected to a computer to be controlled more conveniently with a built-in USB connector and proprietary Software attached to it. It can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at one time.

★INTEGRATION DESIGN & PCB BOARD FIXED - Machine overall system integration design, rework station more integrated workbench area occupied by smaller, didn’t mixed and disorderly of cables. Linear guide type bracket with abnormity pole can be locking, adjusted by rotating the handle, can be very easily fixed PCB board, effectively prevent the deformation of PCB board.

★TEMPERATURE CONTROL & MEASUREMENT SENSOR - The BGA rework station the technology of closed-loop temperature control ensures accurate temperature process and even heat distribution. It sensitive temperature measurement sensor to obtain an accurate and instantaneous temperature reading and monitoring.

★WIDE APPLICATION - This IR6500 Rework station is suitable for laptop motherboards, desktop computer motherboards,server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large circuit board BGA rework.

NOTE！！！This item is only compatible with Win7,Win XP.Basic Parameters:Heating: IRDimension (LxWXH): 475mm x 480mm x 420mm /18.70’’ x 18.90’’ x 16.54’’Weight: 15kg /33.07lbsTotal weight: 17kg /About 37.48lbsCE CertificationElectrical Parameters:Power: AC 110VUpper Heating: IRSize of Upper heating: 80mm x 80mm /3.15’’ x 3.15’’Consumption of upper heating: 400WBottom Heating: IRSize of Bottom heating: 170mm x170mm /6.69’’ x 6.69’’Consumption of Bottom heating: 800WGeneral power: 1250WTemperature Control:Control mode of Upper: Independent temperature control, high-precision closed-loop control, precision ± 0.5%,Control mode of Bottom: Independent temperature control, high-precision closed-loop control, precision ± 0.5%, NO AlarmRework Function:SMDSuit for welding, remove or repair packaged devicessuch as BGA, PBGA, CSP, multi-layer substrates, EMImetallic shield product and solder / lead free ReworkweldingSize of applicable chips: ≤ 70mm x 70 mm /2.76’’ x 2.76’’ Size of applicable PCB: ≤ 400mm x 305mm /15.75’’ x 12.01’’